Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.
Fluxless wafer bump reflow device. Achieves fine bump reflow without wet processes. Sample demo available. Reflow video posted.
Fluxless reflow in a strong reducing H2 radical atmosphere of damage-free downflow-type surface wave plasma, reducing flux application and cleaning processes, as well as application and cleaning equipment. A completely dry CtoC system. Achieving a short tact reflow process for fine pitch bumps.
- Company：神港精機 東京支店
- Price：Other
